The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronics<br> into perspective with the requirements for further microelectronics developments and market necessities. This two-volume handbook<br> presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging<br> technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration<br> to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in<br> detail. This is followed by fields of application and a look at the future of 3D integration.<br> <br> The editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon,<br> Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others.
Mechanical engineering and materials
Handbook of 3D Integration, Volumes 1 and 2
₹14,489.00
Technology and Applications of 3D Integrated Circuits
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