Advanced Electronic Packaging

As in the <i>First Edition</i>, each chapter in this new <i>Second Edition</i> is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the <i>First Edition</i>, which became an industry standard and a popular graduate-level textbook, have been retained.<br /> <br /> An Instructor’s Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.