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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

7,433.00

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ISBN: 9781119289647 Category:

<p><i><b>An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments</b></i></p> <ul> <li>Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility</li> <li>Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft&rsquo;s Excel and Minitab</li> <li>Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail</li> <li>Provides chapter-wise review questions and powerpoint slides as teaching tools</li> </ul>