Adhesion in Microelectronics

<p>This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;</p> <ul> <li>Various theories or mechanisms of adhesion</li> <li>Surface (physical or chemical) characterization of materials as it pertains to adhesion</li> <li>Surface cleaning as it pertains to adhesion</li> <li>Ways to improve adhesion</li> <li>Unraveling of interfacial interactions using an array of pertinent techniques</li> <li>Characterization of interfaces / interphases</li> <li>Polymer-polymer adhesion</li> <li>Metal-polymer adhesion  (metallized polymers)</li> <li>Polymer adhesion to various substrates</li> <li>Adhesion of thin films</li> <li>Adhesion of underfills</li> <li>Adhesion of molding compounds</li> <li>Adhesion of different dielectric materials</li> <li>Delamination and reliability issues in packaged devices</li> <li>Interface mechanics and crack propagation</li> <li>Adhesion measurement of thin films and coatings</li> </ul>