Antenna-in-Package Technology and Applications

<p><b>A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging</b></p> <p><i>Antenna-in-Package Technology and Applications</i> contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. <br /> <br /> The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book:</p> <p>• Includes a brief history of antenna-in-package technology <br /> • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) <br /> • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance</p> <p>Written for students in electrical engineering, professors, researchers, and RF engineers, <i>Antenna-in-Package Technology and Applications</i> offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.</p>