Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries – whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. <i>Lead-free Solders: Materials Reliability for Electronics</i> chronicles the search for reliable drop-in lead-free alternatives and covers: <ul> <li>Phase diagrams and alloy development </li> <li>Effect of minor alloying additions </li> <li>Composite approaches including nanoscale reinforcements </li> <li>Mechanical issues affecting reliability </li> <li>Reliability under impact loading </li> <li>Thermomechanical fatigue </li> <li>Chemical issues affecting reliability </li> <li>Whisker growth </li> <li>Electromigration </li> <li>Thermomigration </li> </ul> <p>Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.</p>
Lead-free Solders
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Materials Reliability for Electronics
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